LED lamp cup request to the ambient temperature for thermal conducting plastics

by:Sehon     2020-10-28

LED lamp cup request to the ambient temperature for thermal conducting plastics? Can be used as usual plastic molding process, thermal plastic LED radiating lamp cup unnecessary secondary processing, suitable for large quantity production. Low thermal expansion coefficient; Molding shorten rate is low, dimension stability is good; Heat resistant high temperature, uniform taking up parts; Full up product design degrees of freedom, the promotion product value, by the way; Coefficient of thermal conductivity size is wide, can be in the 5 w/m. K to 25 w/m. According to need to choose between k ( Coefficient of thermal conductivity unit for W/m. k) ; Have black, white, gray, to choose from: can be based on function parameters pleaded with custom material coefficient of thermal conductivity ( Also known as the thermal conductivity) By the third party inspection organization, and a real authority.

as a result of the information industry and other industries rapidly develop, heat, electromagnetic mask, electrical and electronic engineering, conflict materials, computer cooling accessories, lighting components, optical components, mechanical components, auto parts, medical device, touch material with many fields such as are necessary to thermal engineering plastic, LED thermal conductive materials follow/thermal plastic application in the field of expand, people discuss FangXingWeiYi of thermal conductive polymer materials, especially the rise of high power LED lights, many foreign companies have replaced leds traditional aluminum radiator with integrating many long in a suit of high thermal conductive insulation plastic radiator, the thermal conductivity of modified engineering plastics applications and carried out on a new journey.

TCP100 thermal conductive engineering plastics with high strength, softness, mechanical functions; 40 - weight lighter than aluminum Up 50%, reduced the sensation, stability, can be in ABS, PA, LCP, PPS, PEEK resin selected such as foundation; Processing bento can be used as usual plastic molding process, unnecessary secondary processing, suitable large quantity production; Low thermal expansion coefficient; Molding shorten rate is low, dimension stability is good; Heat resistant high temperature, thermal insulation to raise to the product components uniform stature; Full up product design degrees of freedom, the promotion product value, by the way; Coefficient of thermal conductivity size is wide, can be in the 5 w/m. K to 25 w/m. According to need to choose between k ( Coefficient of thermal conductivity unit for W/m. k) ; Have black, white, gray, to choose from: can be based on function parameters pleaded with custom material coefficient of thermal conductivity ( Also known as the thermal conductivity) By the third party inspection organization, and a real authority.

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