ENERGY STORAGE SYSTEM

LED lighting manufacturer to introduce a good way to solve the LED bulb fever

by:Sehon     2020-10-05

LED bulb fever how to do? LED is the heat will happen, many people will think is LED cold light source, it only refers to the LED light-emitting principle.

LED bulb fever:

the cause of the LED filament bulb fever is due to join the electric energy into light energy, did not appear on the part but converted to heat, electro-optical transformation about 20 ~ 30% power. Also is said about 70% of the electrical energy into heat energy.

in particular, the occurrence of the LED junction temperature is caused by two factors:

within injection to the chip of photons can't appear on the outside and finally converted to heat, this part is the main, because now known as external quantum power, as long as about 30%, mostly is converted into heat.

internal quantum power is not high, also is in the composite, the electrons and holes is not 100% occurred photons, generally called by & other; Current leakage & throughout; The lower the PN area carrier recombination rate. Leakage current is multiplied by the voltage, the power of this part also is converted into heat energy, but it does not occupy a main component part, due to internal photon power is now near 90%.

as previously mentioned, although incandescent light efficiency is very low, only about 151 m/W, but it will be almost all electric energy into light energy and radiation, as most of the radiant energy is infrared, so the light efficiency is very low, but is exempt from the heat dissipation problem.

LED bulb heat treatment methods:

deal with LED bulb heat dissipation, mainly from two aspects, and before packaging, can understand for the LED chip cooling heat dissipation and LED bulb. LED chip cooling is mainly related to substrate and selection and process of the circuit, temporarily not elaborated in this paper. This paper mainly introduces the heat dissipation of LED lights, LED will be made for any lamps and lanterns, so the LED chip heat that had happened in the end the through the shell of lamps and lanterns are scattered into the air. Grey rain, lighting lighting think if cooling owe good, due to the LED chip thermal capacity is small, a little heat piled up will make the chip junction temperature increase rapidly, if long time to work on the condition of high temperature, it would quickly shorten service life. But the quantity of heat to be able to do lead to the chip to the outside air, passes through many ways. Specifically, what happens to the LED chip heat, from the metal heat block it out, first through to the aluminum substrate PCB solder, again through the heat conduction glue to the aluminum radiator. So actually LED hotel engineering lamps and lanterns, heat dissipation includes heat conduction and heat dissipation of two parts.

but LED lamp shell heat according to the power range and use, also can have different choices. Now basically has the following several kinds of cooling methods:

aluminum radiator fins: this is the most common cooling method, using aluminum radiator fins as a part of the shell to add the cooling area.

internal reinforced with longevity high efficiency fan cooling fan lamp shell: low cost, good effect. Electric fan is trouble some, but want to change also does not apply to the field, this plan is relatively rare.

thermal conductive plastic shell, when the plastic shell injection molding filling thermal conductive materials, add a plastic shell heat conduction and heat capacity.

heat pipe radiator skills: heat pipe using thermal tube skills, heat from the LED chip guide to shell the cooling fins. In the large lamps and lanterns, this is a common planning such as street lamps.

air cooling fluid mechanics, fluid mechanics using air lamp shell shape, create convection air, this is the lowest cost to strengthen the cooling method.

looks radiation heat treatment lamp shell they do radiation heat treatment: simple is daub radiation coatings, heat radiation method will bring it from the lamp shell appearance.


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