We should pay attention to heat dissipation problem of LED lamp cup

follow the progress of the LED chip skills, the power of a single LED chip can be up to 3 w, 5 w, the LED chip itself to accept the current density and therefore progress, how to effectively dissipation the heat, the heating effect of the subsequent will serious affect the reliability of the whole LED lights cup and life. LED chip, the gold thread in the process of encapsulation, encapsulating resin, lens, and each link such as chip fever heat dissipation problems must be well. Now development is the chip substrate structure, material and cooling module of external integration skills. Combined with suitable structure and material, the preparation process and parameters for design and preparation of low interface thermal resistance and high heat dissipation performance and lower encapsulation structure of mechanical stress about the future of high-power LED packaging the progress and development of heat dissipation performance has very realistic significance.